$20+ billion and 3-4 years to build modern fabs, risk assessment difficulties, inability to quickly adjust capacity, comparison to other capital-intensive industries
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The semiconductor industry is currently locked in a high-stakes standoff where memory makers must weigh the $20 billion cost of new fabrication plants against the terrifying possibility that an AI bubble burst could leave them with massive debt and empty factories. This caution has led to a strategic pivot toward High Bandwidth Memory (HBM) for enterprise AI, effectively squeezing consumer DRAM supply and creating a shortage that may not resolve until 2028 due to the inherent three-to-five-year lead times for construction. Commenters highlight that this inelastic boom-and-bust cycle is exacerbated by the "natural resource" status of specialized hubs like TSMC, where decades of institutional know-how cannot be easily replicated by government subsidies or optimistic timelines. Ultimately, the prevailing sentiment is that manufacturers will prioritize fiscal survival over aggressive expansion, choosing to let prices remain high rather than risk being the ones left "holding the bag" if demand evaporates.
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